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Introduction
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In today’s mission-critical environments, unwavering reliability and performance are essential to operational success. The 3U VPX Liquid Cooling ATR system, built on OpenVPX architecture, features a rugged, modular enclosure engineered to withstand the most demanding defense and aerospace conditions. Its versatile design supports a wide range of customizable configurations and is scalable to multi-CPU/GPU requirements, leveraging proven components and design techniques to meet diverse mission needs.
Equipped with a hybrid conduction cold plate, based on VITA 48.4 Liquid Flow Through standard, and 7StarLake’s own IP Liquid Flow Through Chip Cold Plate Kit, the 7StarLake 7SL-3500 supports up to 500W TDP capacity within a self-contained, liquid-to-air sealed system and is optimized for high-speed signal processing and compute-intensive workloads. The system also integrates custom and standard 3-slot backplanes with VPX and SOSA-aligned slot profiles, ensuring seamless compatibility and scalability for modern military computing applications.
Why Self-contained Liquid Cooling is Crucial for VPX Systems?
Effective thermal management is critical to unlocking the full performance of VPX systems—safely, reliably, and consistently. In advanced ground vehicles and aircraft, self-contained liquid cooling offers optimal thermal management, delivering superior reliability and performance over traditional air cooling.
Key Advantages of a Self-Contained Liquid Cooling VPX System for Military Ground Vehicles and Large Drones:
No need for a separate water tank, which is particularly beneficial for space-constrained and mobile platforms such as vehicles and UAVs
The integration of the cooling system within the VPX unit minimizes the need for external plumbing, coolant lines, and auxiliary hardware, leading to significant space savings.
Reduced exposure of coolant channels to the operational environment lowers the risk of leakage, contributing to higher system integrity and reliability.
The modular, all-in-one design allows for faster system deployment and streamlined maintenance procedures, supporting rapid field servicing and mission readiness.
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Typical Application
- 7StarLake 3U VPX Liquid Cooling ATR 7SL-3500
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7StarLake’s scalable, customizable, and rugged VPX ATR system is engineered for compute-intensive, SWaP-constrained mission-critical applications, making it ideal for deployment in the most demanding military and aerospace environments.
Model No. Liquid Cooling Type Payloads Max Power 7SL-3500-L2L Liquid to Liquid 1CPU 2GPU 500W 7SL-3500-L2A Liquid to Air 1CPU 2GPU 500W
- 7SL-3500-L2A
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Liquid Cooled to Air
7SL-3500 hybrid conduction cold plate assisted by liquid cooling sets with aggregate power demands over 500W
Internal recirculation fans ensure liquid cooling set is across conduction cooled payload modules, minimizing hot-spots and dissipating heat homogeneously
- NVIDIA Ampere Architecture
- PCIe Gen4x16 interface
- 16GB GDDR6 Memory, 256-bit Bandwidth
- 5888 CUDA Cores, 17.66 TFLOPS SP Peak
Specification
Thermal Passive Liquid Coolied Payload 3 1xCPU+ 2xGPU GPU 2 2x RTX A4500 NIC 1 1x 1G Backplane 3 3-Payload Max PSU 500W 28VDC 
Physical Dimensions: 10.6” (H), 7.6 (W) x 19.5" (D) incl. handles and connectors 269mm x 190mm x 496mm including connectors and mounting plate Machined aluminum alloy 6061-T6, bolt together construction. Weight: Approximately 30kg, with payload boards.
I/O Capabilities Custom I/O panel supporting high speed connectivity.
High density MIL-STD 38999 circular connectors.Payload Compatibility 3U VPX multi-core single board computers, high speed GPGPU modules, video processing and Ethernet switching Backplane VPX aligned slot profiles VITA 48.8 Environmental Designed to meet MIL-STD-810, Vibration, Shock Power Supply Input voltage: 18 to 36 VDC Output: up to 500W total 
- 7SL-3500-L2L
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Liquid to Liquid
7SL-3500 Hybrid conduction cold plate assisted by Liquid cooling sets with aggregate power demands over 500W
A liquid-to-liquid cooling system cools below ambient temperature and offers similar temperature stability to a recirculating chiller. Instead of rejecting the waste heat to the room, it transfers it to chilled facility water via a liquid-to-liquid heat exchanger
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2x NVIDIA RTX A4500, 16GB GDDR6, 5888 CUDA or 2x NVIDIA Quadro 5000 Ada GDDR6, 9728 CUDA
Specification
Thermal Passive Liquid Cooled Payload 3 1xCPU+ 2xGPU GPU 2 2x Quadro 5000 Ada NIC 1 1x 1G Backplane 3 3-Payload Max PSU 500W 28VDC 
Physical Dimensions: 10.6” (H), 7.6 (W) x 19.5" (D) incl. handles and connectors 269mm x 190mm x 496mm including connectors and mounting plate Machined aluminum alloy 6061-T6, bolt together construction. Weight: Approximately 30kg, with payload boards. I/O Capabilities Custom I/O panel supporting high speed connectivity
High density MIL-STD 38999 circular connectors.Payload Compatibility 3U VPX multi-core single board computers, high speed
GPGPU modules, video processing and Ethernet switchingBackplane VPX aligned slot profiles VITA 48.8 Environmental Designed to meet MIL-STD-810 Power Supply Input voltage: 18 to 36 VDC Output: up to 500W total -