OXY5741A
Intel 9th/8th Gen. Xeon/Core Processor, EBX with PCIe/104
- 9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
- EBX SBC Dedicates PCIe/104 Type 2
- Dual channel DDR4-2400 with up to 128GB *, ECC for Xeon SKU
- Three simultaneous displays with 48 bit LVDS + HDMI + DP
- NVMe PCIe Gen3x4 SSD and 4x SATA 3.0
- USB 3.2 Gen2 (10 Gbps), TPM 2.0
- Dual GbE LAN, RS-232/422/485
- M.2 B-Key 2280/3042 (M-Key 2280 optional) and M.2 E-Key 2230
- Technical Profile
- Specifications
- 동영상
- Introduction
-
7STARLAKE, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, PERFECTRON EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40 to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.
- Key Features
-
- 9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
- EBX SBC Dedicates PCIe/104 Type 2
- Dual channel DDR4-2400 with up to 128GB *, ECC for Xeon SKU
- Three simultaneous displays with 48 bit LVDS + HDMI + DP
- NVMe PCIe Gen3x4 SSD and 4x SATA 3.0
- USB 3.2 Gen2 (10 Gbps), TPM 2.0
- Dual GbE LAN, RS-232/422/485
- M.2 B-Key 2280/3042 (M-Key 2280 optional) and M.2 E-Key 2230
- What is Small Form Factor (S.F.F)?
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Small form factor computer is the crucial component that drives the entire system operation as they can fit into smaller spaces and consume less power. They can be packaged and mounted in diverse ways than larger boards. The reduction of size, weight, and cost (SWaP) has been continuously emphasised as more computer systems demand smaller processor and network connectivity solutions. As a result, application such as automation and transportation which demand more differently stackable ways often employ small form factors architecture.
- DDR4 2400 128GB Optimised Performance
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Since speed and power matters most in computing performance, OXY5741 is built in 4x SO-DIMMs up to 128GB to deliver optimisation of the performance. Adding DDR4-128GB not only maximises CPU and computing performance, but also enables more robust and responsive virtual machines and applications. Taking advantage from the cutting edge DRAM technology, OXY5741-EBX XEON SBC can optimise system performance by accelerating the memory capacities of servers.
- Ruggedised Open Standard PCIe/104 Facilitate Flexible Expansion
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Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedised, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741 employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key (M-Key 2280 optional), and PCIe 3.0 x 4 NVMe. Additionally, OXY5741 provides 3.0 ports for data redundancy by supporting RAID 0/1.
- High Performance and Fast Storage
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Today, ruggedised systems or computers are expected to possess speedy and smooth response times. In light of making these systems render high performance, NVMe protocol delivers a high-bandwidth and low-latency user experience. Moreover, via accessing a PCIe bus that supports a huge number of parallel command queues, NVMe can effortlessly access flash storage. This platform incorporates Intel® Xeon E-2276ME with 4 cores. OXY5741 supports up to 64GB of dual-channel DDR4 2400MHz memory and features an M.2 M-Key 2280 slot for NVMe / PCIE Gen3x4 high-speed PCIe SSD storage, thus offering extremely high data speeds for processing. The above features make OXY5741 an outstanding solution for applications that demand high performance in a EBX form factor.
System |
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|
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CPU |
Core i5-8400H Processor (4Core/8Threads ,8M Cache , up to 4.20GHz),45W Core i7-9850HE Processor (6Core/12Threads ,12M Cache , up to 4.40GHz),45W Core i7-9850HL (6Core/12Threads ,9M Cache , up to 4.10GHz),25W XEON E-2276ME (6Core/12Threads ,12M Cache , up to 4.50GHz),45W XEON E-2276ML (6Core/12Threads ,12M Cache , up to 4.20GHz),25W |
|
Memory Type |
4 x 260 Pin DDR4 SO-DIMM (up to 128GB) 4x260Pin DDR4 2400MHz SO-DIMM (up to 128G) |
|
Chipset |
CM246 |
|
BIOS |
AMI UEFI 256 Mbit |
|
Watchdog |
1-255 sec. or 1-255 min. software programmable and can be generate system reset |
|
TPM |
SLB9665 TPM 2.0 |
|
iAMT |
iAMT 12.0 |
|
Expansion slot |
|
|
M.2 |
1 x M.2 (M-key, type:2280, SATA/PCIe 3.0x4 NVMe) |
|
FPE |
1 |
|
PCIe/104 |
Type 2 |
|
Mini-PCI |
2 x Full size (PCIe x1,USB 2.0 and micro SIM Card) |
|
Display |
|
|
LVDS |
Dual channel 24-bit LVDS, max resolution up to 1920 x 1200 with 60Hz |
|
DP |
DP 1.2 (up to 4096x2304 @ 60Hz) |
|
Multi-Display |
Triple simultaneous displays with 48-bit LVDS + DP |
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Ethernet |
|
|
Chipset |
1 x Intel I210-IT & 1 x I 219-LM GbE |
|
WOL |
Yes |
|
Boot from LAN |
Yes for XPE |
|
Audio |
|
|
CODEC |
ALC887 |
|
Rear I/O |
|
|
DP/HDMI |
2 x DP |
|
USB |
4 x USB 3.1 (Gen.2, 10Gbps) |
|
Ethernet |
2 |
|
Front I/O |
|
|
DC Connector |
1 |
|
LED |
6 (HDD, 2 x LAN ACT+LINK) RED/GREEN LED |
|
Power Switch |
1 |
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USB |
2 x USB 3.0 |
|
Internal I/O |
|
|
USB2.0 |
2 |
|
GPIO Header |
1 (1 x 10pin) |
|
SATA |
4x SATAIII (RAID 0,1,5) , from 2 up to 4 ports |
|
Audio Header |
LINE-OUT/MIC-IN |
|
Serial |
2 (RS-232/422/485 autoflow control) |
|
Inverter |
1 |
|
LVDS |
1 |
|
FAN |
1 x 4-Wire Smart Fan, 12V@2A |
|
Front Panel Control |
Power LED, HD LED, Reset, Power Switch, Buzzer |
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Power Management |
|
|
ACPI |
ACPI 3.0 |
|
Power Supply Voltage |
Supports single 12V input, ± 10% |
|
Power Consumption (Idle) |
TBD |
|
Mechanical and Environmental |
|
|
Form Factor |
EBX |
|
Power Type |
DC-12V |
|
Power Consumption |
250W |
|
Dimension |
146 mmX 243mm |
|
Operating Temperature |
-20℃ to 60℃ |
|
Storage Temperature |
-40℃ to 85℃ |
|
Relative humidity |
10% to 90%, non-condensing |