3/4 Short ATR
- Intel®Xeon E-2276ML (12M Cache, 2.0 GHz, up to 4.20 GHz, 6-cores, 12 threads)
- NVIDIA®RTX A2000 MXM GPU ; Option NVIDIA®RTX A1000 MXM GPU
- Modular rugged chassis with stackable PCIe/104 I/O card expansion.
- IP65 sealed chassis with Amphenol DTL-38999 connectors
- Extreme rugged temperature : -40°C to 70°C
- 28V DC MIL-STD-461/1275 Power supply with Voltage transient protections/EMI_EMC conditions
- MIL-STD-810 Thermal Shock, Vibration, Humidity
- Technical Profile
- Order Information
- Thermal Solution
ATR (Air Transport Rack) is a standard that specifies form fit and function of enclosures designed to protect the main internal system. This military enclosure must meet EMI / EMC requirements to prevent noise interference, provide lightning protection and be isolated from small particle contaminants. So, it can be deployed in unmanned aerial vehicles, fighters, and helicopters. To satisfy diverse conditions, ATR chassis are available in different sizes—1/2, 3/4 and Full ATR sizes. Based on 3/4 ATR size, StackRack launches a new Rugged Airborne Mission Computer F30.
As a modular mission computer, F30 features a build in EBX OXY5741A SBC powered by Intel 9th XEON E-2276ML(6 Cores, Max Turbo up to 4.2GHz). Fusing NVIDIA RTX A2000 MXM with 2 x LAN, 4 x USB and 2 x COM for device connects ability and conbine Military Standard 18V~36V DC-IN power module), F1-30 is an optimum choice for high performance computing, demanding graphics applications, GPU-accelerated data processing, yet ruggedized enough for harsh environments..
- How to extend dense GPU?
PCIe / 104 Type II & FPE
Powered by Xeon E-2276ML and PCH-CM246, PCIe/104 type II & FPE bring PCIe x 4 or PCIe x 16 bus to GPU and ruggedised, such as SK220 carrier module to extend the RTX A2000
- MIL-STD-1275/704 Power Supply
F30 is designed with MIL-STD-1275/704, protecting against vehicle/aircrafts voltage surges, spikes and transients, and even electromagnetic interference. This characteristic is well suited for the strictest military requirement and delivers optimal performance in harsh conditions.
SK711, the power board adopted by F30, supports input range from 18V to 36V. Compliant with MIL-STD 1275/461, SK711 performs as an ideal converter module for severe environment. The Cosel Hi-Rel DC/DC CONVERTER also provides ,Output Over Current Protection (OCP), Output Overvoltage Protection (OVP) and Over Temperature Protection (OTP) to made stability and safety. Module Compliance with MIL-STD-461C/D/E Standards. Furthermore, with parallel design, two SK711 combining can generate double power of 300W, supporting prominent system performance.
Intel®Xeon E-2276ML (12M Cache, 2.0 GHz, up to 4.20 GHz, 6-cores, 12 threads)
4 x DDR4 SO-DIMM 2666MHz up to 128GB
NVIDIA Quadro RTX A2000, MXM Type(8GB-GDDR6, CUDA 2,560)
Option : NVIDIA Quadro RTX A1000, MXM Type(4GB-GDDR6, CUDA 2,048)
1 x M.2 (M-key, type:2280, SATA/PCIe 3.0x4 NVMe)
|Storage(2)||Support up to 4x SATAIII (RAID 0,1,5) SSD backup storage|
|X1||2 x DVI with D38999|
|X2||2 x COM(RS232/422/485) with D38999|
|X3||1 x DIO(4in/4out) with D38999|
|X4||2 x LAN with D38999|
|X5||2 x USB3.0 with D38999|
|Power||1 x DC-IN with D38999|
|Power Button||1 x Waterproof Button with Backlight|
|Weight||16 Kg (35.24 lb)|
|Dimension (W x H x D)||190.5(W) x 320.5(L2) x 269.88(H) mm|
DC-IN 18V~36V, 300W Military Standard Power Module
|Operating temperature||-40°C to 70°C|
|Storage temperature||-40°C to 85°C|
|Relative Humidity||Up to 95%RH @40°C, non-condensing|
|Ingress Protection||Designed for compliance to IP65, MIL-STD-810G|
|EMI/EMC||Designed to meet MIL-STD-461|
|Temperature||Designed to meet MIL-STD-810|
|Vibration & Shock||Designed to meet MIL-STD-810|
|SK220||Graphic module with NVIDIA RTX A2000 GPU supports four DP output|
Frame Grabber : 4xCH HD-SDI
Dual 10GbE (Intel X710) Ethernet Ports
MIL-1553 , ARINC 429
Thermal Solution—Conductive Cooling
A solid material that can effectively conduct the heat is used to move the heat to the system enclosure and dissipated to the external surroundings. The machined copper cooling plates matching the component layout are placed between each layer; heat is carried away to the edges where a Wedge-Lock mechanism secures inside the chassis, coming up with a thermal interface.