OXY5361A
3.5" SBC Intel® Skylake-U Core™ i7-6600U Processor, 2 x DDR4 SO-DIMM, 2 x DisplayPort, 1 x LVDS, 6 x USB, 2 x COM, 9V to 36V DC-in, -40°C to 85°C
- Support 6th Generation Intel® Core™ i7-6600U Processor
- 2 x SO-DIMM, supports Dual Channel DDR4 1866/2133 up to 32GB
- 1 x Full-size mPCIe, 1 x Half-size mPCIe
- Multi display: 2 x DisplayPort ; 1 x Dual Channel 24 Bit LVDS
- Dual LAN Ports ( Intel I210-IT & 1 x I219-LM GbE)
- 2 x COM Ports: 1 x RS-232, 1 x RS232/422/485
- 6 x USB Ports: 4 x USB 3.0, 2 x USB 2.0
- Wide range 9V to 36V DC-in
- Extended operating temp. -40°C to 85°C
- Technical Profile
- Specifications
- CPU
Technical Profile
OXY5361A is a highly integrated 3.5" rugged SBC driven by Intel® Skylake U SoC i7-6600U soldering onboard With processor soldered onboard can significantly enhance the resistance of vibration and shock. Processor supports graphics (HD Graphics 500 Series) and CPU performance and equips with rich legacy I/O features such as: 2 COM Ports; 8 Bit DIO; 6 USB Ports. With 2 DisplayPort and a Dual Channel 24 Bit LVDS, OXY5361A can fulfill diverse needs of modern day display & monitor control applications.OXY5361A can operate in harsh environment under temperature range from -40°C to 85°C and avoid damage from sudden surge of voltage with its 9V to 36V DC input design.
Rich I/O interface – Extensive Functionality
Rich I/O design endows OXY5361A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 2 COM, 6 USB, 2 LAN, and dual Channel 24-bit LVDS, OXY5361A provides a wide array of choices to expand and connect to different devices.
Extended Temperature Operation
7STARLAKE aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5361A can operate from -40°C to 85°C, our strict manufacture procedure guarantees supreme performance in severe environment.
Efficient thermal solution
A tailor-made heat spreader is what 7STARLAKE provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5361A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.
Operating Temp. |
|
|---|---|
|
-40°C to 85°C |
|
System |
|
|
CPU Type |
Intel® Skylake-U SoC 14nm Core™ i7/i5/i3 BGA Type |
|
Intel® Core™ i7-6600U Processor (2C, 4M Cache, up to 3.40 GHz) |
|
|
Intel® Core™ i5-6300U Processor (2C, 3M Cache, up to 3.00 GHz) |
|
|
Intel® Core™ i3-6100U Processor (2C, 3M Cache, 2.30 GHz) |
|
|
Chipset |
SoC, integrated with CPU |
Expansion Slot |
|
|
mPCIe |
1 x Full-size mPCIe/mSATA |
Display |
|
|
Chipset |
Intel® HD Graphics 500 Series |
|
DisplayPort |
2 (Max Resolution 4096*2304) |
|
LVDS |
Dual Channel 24-bit LVDS |
|
Display Type |
DisplayPort, LVDS |
Audio |
|
|
Codec |
Realtek ALC888 |
Ethernet |
|
|
Chipset |
1 x Intel® I210-IT & 1 x Intel® I219-LM GbE LAN |
|
WOL |
Yes |
|
Boot from LAN |
Yes for PXE |
Rear I/O |
|
|
DisplayPort |
2 x DisplayPort |
|
Serial Port |
1 x RS232 /w 5V/12V selectable |
|
Ethernet |
2 x RJ45 ports (support 10/100/1000 Mbps for 2 x RJ45 ports) |
|
USB |
4 x USB 3.0 |
Internal I/O |
|
|
SATA |
1 x SATAIII (6 Gb/s) |
|
USB |
2 x USB 2.0 by pin header |
|
COM |
1 x RS232/422/485 |
|
AUDIO |
Mic-in, Line-in/out |
|
FAN |
1 x CPU fan |
|
LVDS |
40-pin connector |
|
DIO |
8-bit (4 in/4 out) |
OS support list |
|
|
Windows |
Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64 |
|
Linux |
Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
|
Form Factor |
3.5" SBC |
|
Power Type |
9V to 36V DC-in |
|
Dimension |
146 x 102 mm (5.7" x 4") |
|
Operating Temp. |
-10℃ to 85℃ |
|
Storage Temp. |
-40℃ to 85°C |
|
Relative Humidity |
10% to 90%, non-condensing |
The OXY5361A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Test Result
|
Device Model |
OXY5361A |
|
Tester |
Marc Liu |
|
Test Result |
Pass |
|
Test Temperature |
High 0°C to 85°C/ Low -40°C to 0°C |
|
Test Time |
5 Hours / 2 Hours |
|
Test Standard |
Reference IEC60068-2 |
|
Test Software |
Burnin test v6.0 |
|
Criteria |
After testing, system can't halt. |
Test Configuration
| Device | Configuration | Manufacturer | Part Number |
| CPU Type | Intel® i7-6600U ( 2.60 GHz) | Intel | i7-6600U |
| XR-DIMM | APACER DDR4 SO-DIMM 16GB 2133 | ||
| Port1 SATAIII | TRANCED 256G SSD | ||
| Port2 msata half | innodisk 3me 64G | ||
| Port3 msata | innodisk 3me2 256G | ||
| USB3 ~ USB4 | USB Keyboard / Mouse | ||
| LAN1 | Intel® I219 GbE | Intel | Intel® I219 GbE |
| LAN2 | Intel® I210 GbE | Intel | Intel® I210 GbE |
| Test Software | Burnin test v8.1、AS SSD、iperf | ||
| Chamber | KSON THS-b4t-150 Chipeng SMO-3 | KSON Chipeng | THS-b4t-150 SMO-3 |
Thermal Measurement
PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyze the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5361A-i7-6600U for one hour, from 50°C to 85°C.