THOR100-X11
1U Half Military Server
- Intel® 11th Tiger Lake - UP3 i7-1185G7E
- Up to DDR4-32GB
- Dual M.2 Slots:
- 1 x M.2 2242/2260/2280 B-key(SATA, PCIex1),
- 1x M.2 2230 E-key (PCIe, USB)
- Amphenol M12 connector applied
- IP65 classify
- Design for Naval Defense System , withstand 75G rms Shock
- 8V to 24V DC-in ; 18V~36V MIL-461 EMI Filter by Optional
- Extended operating temperature: -40°C to 70°C
- Technical Profile
- Specifications
- CPU
- Thermal Solution
- Download
THOR100-X11 is driven by Intel 11th generation Tiger Lake-UP3 i7-1185G7E processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Tiger Lake-UP3 processor supports outstanding CPU and graphics performance, providing quad cores 4.4GHz clock speed while consuming low power consumption 12W and Max. 28W. THOR100-X11 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type but a D38999 mini DP connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR100-X11 supports extended temperature from -40 to 70°C and wide range 8V~24V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
- Robust Product Design Ready For Military Application
System |
|
|---|---|
| CPU | Intel® Core™ i7-1185G7E Processor (4 Core/ 8 Threads, 12M Cache up to 4.40 GHz), 15W/28W |
| Memory Type | DDR4 3200MHz / 1 x 260-pin SO-DIMM/Max.32GB (Non-ECC) |
| Expansion Slot |
1x M.2 2230 E-key (Wifi & BT, PCIe/USB) 1x M.2 2242/2260/2280/3042/3052 B-key (Storage/5G/LTE, USB2.0/PCIe x 1/SATAIII) |
Display |
|
| Chipset | Intel® Iris Xe Graphics |
| Mini DP | Up to 5120 x 3200 @60Hz |
Storage |
|
| SDD | 1x 2.5" SDD - Up to 1TB Capacity |
Ethernet |
|
| Chipset | Intel® I219LM Giga LAN+I225LM 2.5G |
Front I/O |
|
| Button | Water Resistive Power Button with dual-color LED Backlight |
| X1 (Mini DP) | Mini DP connector (Amphenol MDPFTV7AZNF312 2D-45) |
| X2 (COM) | 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001) |
| X3 (LAN) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
| X4 (LAN) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
| X5 (USB 2.0 x2) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
Rear I/O |
|
| Gound Screw | 1 |
| DC-in | 4-Pin S-code Male M12 Connector (Amphenol M12S-04PMMS-SF8001) |
OS support list |
|
| Windows | Windows@10 64-bit |
| Linux | Support by request |
Mechanical and Environment |
|
| Power Input | 8V to 24V DC-in, AT/ATX mode |
| Dimension | 220 x 380 x 44 mm |
| Ingress Protection | IP65 |
| Weight | 5.5 kg |
| Operating Temp. | -40°C to 70°C (ambient with air flow) |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
Test Standard |
|
| MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE compliant |
| Green Product | RoHS, WEEE compliance |
The THOR100-X11 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Effective cooling solution for maximum heat dissipation:
7STARLAKE implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor to absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, THOR100-X11 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C.
| Attachment | Size |
|---|---|
| THOR100-X11 System performance Test Report _202304.pdf (2.62 MB) | 2.62 MB |