PS2
Dual Display Portable GPU Server
- Dual 23.8" FULL HD 1920X1080 Portable GPU Server
- Optional for UFD 3840X2160
- MIL-STD810 Thermal, shock, vibration, Humidity / EMI / EMC Resistance
- Intel® Ice Lake 3rd Gen. Xeon® Scalable CPU
- Nvidia Quadro RTXA4000 GPU (6,144 CUDA)
- Redundant AC 100~240V Input
- MIL-STD -461 18V~36V DC-Input (optional)
- Extreme Temperature : -20°C to +55°C
Applications
- Naval Tracking Radar Displays
- Naval Optronic Displays
- Marine ECDIS Consoles
- Naval WECDIS Consoles
- Air Defence Tracking Radar Displays
- Air Defence Optronic Displays
- Technical Profile
- Specifications
- Multifunction Naval Console
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PS2 - Dual 23.8” UFD TFT-LCD Multifunction Naval Console provides a sophisticated, graphically-orientated, Human-Machine Interface (HMI) for any naval or marine application. The PS2 can simultaneously display HMI graphics and text from multiple software applications as well as display images from several video sensors and overlay high-resolution graphics and symbology over the video images.
In addition, the PS2 allows the human user to interact with the application using a combination of QWERTY keyboard, mini touch-entry color TFT-LCD display, handgrip, rollerball, fast function keys, programmable soft-keys and on-screen menus.
- System Features
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- Dual 23.8” TFT-LCD Portable GPU Server
- MIL-STD810 Thermal, shock, vibration,Humidity / EMI / EMC Resistance
- Intel® Ice Lake 3rd Gen. Xeon® Scalable CPU
- Nvidia Quadro RTXA4000 GPU (6,144 CUDA) Redundant AC 100~240V Input
- MIL-STD -461 18V~36V DC-Input (optional)
- Extreme Temperature : -20°C to +55°C
- I/O Interfaces
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- X1: 1 x VGA , with D38999 connector
- X2: 2 x Giga LAN , with D38999 connector
- X3: 2 x COM , with D38999 connector
- X4: 2 x USB2.0 , with D38999 connector
- X5: 1 x USB3.0 , with D38999 connector
- X6: 1 x DC-in , with D38999 connector
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System |
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DISPLAY |
DUAL 23.8" TFT-LCD , LCM, FULL HD 1920X1080 - 250 NITS (Optional for 1000Nits) |
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CPU |
Intel® Xeon® Scalable Processors Single Socket LGA-4189 supported, CPU TDP supports Up to 165W TD |
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Memory type |
6 DIMM slots Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC RDIMM, |
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DIMM Sizes |
LRDIMM: 32GB, 64GB, 128GB RDIMM: 8GB, 16GB, 32GB, 64GB |
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Chipset |
Intel® C621 |
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Graphics |
ASPEED AST2500 BMC |
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GPU (optional) |
Nvidia RTXA4000, NVIDIA Ampere GPU architecture 6,144 NVIDIA® CUDA® Cores, 192 NVIDIA® Tensor Cores 16GB GDDR6 Memory with ECC, Up to 448 GB/s Memory Bandwidth Max. Power Consumption: 140 W |
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Expansion Slot (PCI-E) |
2x PCI-E 3.0 x16, 1x PCI-E 3.0 x8 |
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Expansion Slot (M.2) |
M.2 Interface: PCI-E 3.0 x4 Form Factor: 2280, 2242 Key: M-Key |
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BIOS |
AMI UEFI ACPI 6.0 RTC (Real Time Clock) Wakeup |
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Storage |
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SATA |
2x SATA3 SSD (6Gbps) port (s) (Max 12 SATA3) |
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Ethernet |
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Ethernet (Internal) |
Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512 |
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Front I/O |
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X1 |
1x VGA , with D38999 connector |
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X2 |
2x Giga LAN , with D38999 connector |
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X3 |
2x COM , with D38999 connector |
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X4 |
2x USB2.0 , with D38999 connector |
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X5 |
1x USB3.0 , with D38999 connector |
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X6 |
1x DC-in , with D38999 connector |
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Power |
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Power input |
Redundant AC 100~240V Input MIL-STD -461 18V~36V DC-Input for optional |
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Operating System |
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OS |
Windows® 10 64-bit / Linux (support by request) |
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Physical |
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Dimension |
HEIGHT: 16.31" (414MM) WIDTH: 24.58" (624MM) DEPTH: 10.56" (268MM) |
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Weight |
Active Cooled 15 Kg Conduction Cooled 20 Kg |
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Chassis |
SECC |
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Heatsink |
Heatsink Aluminum Alloy with Fan |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-20 to 60°C |
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Storage Temp. |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 Specifications (Operating) |
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Method 502.5 |
Low Temperature |
-20°C, 4 hours, ±3°C |
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Procedure 2 |
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Method 501.5 |
High Temperature |
+60°C, 4 hours, ±3°C |
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Procedure 2 |
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Method 507.5 |
Humidity |
85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles. |
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Method 514.6 |
Vibration |
5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
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Method 516.6 |
Shock |
20 Grms, 11ms, 3 axes. |
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MIL-STD-810 Specifications (Non-Operating) |
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Method 502.5 |
Low Temperature Storage |
-33°C, 4 hours, change rate:≦20°C/ Hour -15°C, 72hours (By request) |
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Procedure 1 |
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Method 501.5 |
High Temperature Storage |
+71°C, 4 hours, change rate:≦20°C/ Hour +63°C, 240 hours (By request) |
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Procedure 1 |
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Method 514.6 |
Vibration |
5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
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Method 516.6 |
Shock |
20 Grms, 11ms, 3 axes. |