SR10A-X3
Military Video Frame Grabber Fanless Computer , Extended Temp. -40°C to 60°C
- Intel® Core™ i7-7820EQ,
- 8CH Video Input
- 9V~36V DC-IN
- Extended Temperature -40°C to 60°C
- 5MIL-STD-810 Vibration Method 514.6: ◎Acceleration : 7.5 Grms
- MIL-STD-810 Vibration Method 514.6: ◎PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form: Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration: 75G
- Technical Profile
- Specifications
- CPU
- Thermal Solution
- Download
Technical Profile
Introduction
The SR10A-X3 based on Intel® Haswell QM175 chipset, is powered by Intel® 7th generation Core™ processor onboard. The SR10A-X3 can operate effectively in harsh environment under temp range from -40°C to 60°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10A-X3 is based on EBX form factor, DDR4 up to 32GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0 and 1 COM port. SR10A-X3 supplies wide power voltage from 9V to 36V DC-in.
- Frame Grabber Card (Analog to Digital / PAL )
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Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center. SR10A-X3 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.
Digital HD-SDI video input
1CH, Mini PCIe HW encode video capture card
Analogic PAL video input
4CH, Mini PCIe Video Capture Card
Analogic PAL video output
1CH, Scan Converter Board
- Unique Challenges
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MIL-STD-810G standard designed for shock and vibration
SR10 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10A designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With optional Bumper design, the level of vibration resistance increased.
Wire Rope Vibration Isolator Design for Higher Vibration Resistance
7starlake has especially design a Wire Rope Vibration Isolator for SR10A. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.
Specifications
Operating Temp. |
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| -40°C to 60°C | ||||||||||||||||||||||||||||||||||||||||
System |
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| CPU | Core i7-7820EQ, 3.0/3.7 GHz, 4C, 8T, 8M Cache, TDP 45W | |||||||||||||||||||||||||||||||||||||||
| Chipset | Intel® QM175 Chipset | |||||||||||||||||||||||||||||||||||||||
| Memory Type | DDR4 Up to 32GB SO-DIMM | |||||||||||||||||||||||||||||||||||||||
| Ethernet Chipset | 2x RJ45 Intel® I210IT & i217LM GbE | |||||||||||||||||||||||||||||||||||||||
Front I/O |
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| Power Button | 1x | |||||||||||||||||||||||||||||||||||||||
| LED | 1x Power, 1x HDD, 1x LAN | |||||||||||||||||||||||||||||||||||||||
| USB | 2x USB 3.0 | |||||||||||||||||||||||||||||||||||||||
| POWER | 1x Terminal Block | |||||||||||||||||||||||||||||||||||||||
Rear I/O |
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| Display Port | 2x | |||||||||||||||||||||||||||||||||||||||
| DVI-I | 1x DVI-I | |||||||||||||||||||||||||||||||||||||||
| Ethernet | 2x RJ45 ports | |||||||||||||||||||||||||||||||||||||||
| COM | 1x RS232/422/485 | |||||||||||||||||||||||||||||||||||||||
| USB | 2x USB 3.0 | |||||||||||||||||||||||||||||||||||||||
Display |
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| Display Interface | 2x DP | |||||||||||||||||||||||||||||||||||||||
| DVI-I | 1x DVI-I | |||||||||||||||||||||||||||||||||||||||
Mechanical and Environment |
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| Power Requirement | 9V~36V DC-IN, AT/ATX mode with power delay on/off | |||||||||||||||||||||||||||||||||||||||
| Dimension | 262 x 149 x 69 mm | |||||||||||||||||||||||||||||||||||||||
| Weight | 4.11 Kg(9.04 lbs) | |||||||||||||||||||||||||||||||||||||||
| Operating Temp. | -40°C to 60°C (ambient with airflow) | |||||||||||||||||||||||||||||||||||||||
| Storage Temp. | -40°C to 85°C | |||||||||||||||||||||||||||||||||||||||
| Relative Humidity | 5% to 95%, non-condensing | |||||||||||||||||||||||||||||||||||||||
Test Standard |
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| MIL-STD-810 Test |
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| EMC | CE and FCC certificated | |||||||||||||||||||||||||||||||||||||||
| Green Product | RoHS, WEEE compliance | |||||||||||||||||||||||||||||||||||||||
CPU
The rugged MIL-STD compliant system, SR10A-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
| Device Model | SR10A-X3 |
| Tester | Ian Huang |
| Test Result | Pass |
| Test Temperature | High 0°C~70°C / Low -40°C~0°C |
| Test Time | 8Hours / 3Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burnin test v7.1、 Crystal DiskMARK3.03, Intel Extreme Tuning Utility1 |
| Criteria | After testing, system can't halt. |
- Test Standard
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Device
Configuration
CPU
Intel® Core i7-7820EQ 3.0GHz
PCH
Mobile Intel QM175 Express Chipset
Memory
Swissbit SO-DIMM 4 GB DDR4-1600
port3 SATAII
Innodisk 3ME3 mSATA 64GB
port4 SATA II
Apacer 64GB Onboard SSD
LAN1
Intel(R) I210 Gigabit Network Connection
LAN2
Intel(R) I217-LM Ethernet Connection
Test Software
Burnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 4.3.0.11Chamber
KSON THS-b4t-150 Chipeng SMO-3
- Thermal Measurement
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The rugged MIL-STD compliant system, SR10A-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
SR10A-X3 IO Performance
Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C CPU T-J 2 20 98 100 100 100 100 100 100 100 CPU Die -9.7 8.5 81.5 84.2 92.1 93.5 95.5 97.3 97.7 100.6 Heatsink -33.7 -16.2 61.3 64.3 69.4 72.4 76.2 79.8 83.5 87.2 Δ1=(TJ-Die) 11.7 11.5 16.5 15.8 7.9 6.5 4.5 2.7 2.3 -0.6 Δ2=(Die-Sink) 24 24.7 20.2 19.9 22.7 21.1 19.3 17.5 14.2 13.4 CPU Frenquency (GHz) 2.79 2.79 2.69 2.59 2.49 2.19 2.00 1.70 1.20 0.90
Thermal Solution
Effective cooling solution for maximum heat dissipation:
7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10A-X3 can ensure high reliability and stability while working under wide range temperature from -40°C to 60°C
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g
Pure Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.
• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000
Copper Heat spreader
Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure
• 99.9% purity of copper, weigh 470 g
Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.
• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.
Download
| Attachment | Size |
|---|---|
| SR10_Shock_Test_3.pdf (1.19 MB) | 1.19 MB |
| SR10_Vibration_Test_3.pdf (1.19 MB) | 1.19 MB |