Name: THOR200-N8
Availability: InStock

THOR200-N8

2U Half Military Switch Server

Intel^® Ice Lake-D D-2712T Processor
8 Ports LAN Support
DDR4 Up to 256GB Registered ECC RDIMM
Or Up to 512GB LRDIMM
4x GbE, 2x 10GbE, 2x 25GbE
Compliant with MIL-STD-810, MIL-STD 461
18V~36V DC-IN EMI Filter
Operating temp. -40 to +60°C

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Technical Profile
Specifications
Order Information

Introduction

In the high-speed and demanding military arena, robust and secure network connectivity plays a pivotal role in facilitating seamless communication and efficient data sharing across diverse devices. Our Switch Server Solution is designed to empower you with unparalleled performance and reliability.

THOR200-N8, boasted up to 2x25GbE ports and 2x10GbE ports, ensuring lightning-fast data transmission capabilities. The server is powered by the Xeon D-2712T processor, renowned for its exceptional processing power and efficiency. With support for up to 256GB Registered ECC RDIMM, this server delivers enhanced memory performance, allowing for optimized data handling.

THOR200-N8 provides military personnel with the means to make swift and informed decisions, leveraging its superior data transfer speeds. By leveraging this advanced technology, operational efficiency can be significantly improved, giving you an undeniable advantage on the battlefield.

Intel^® Xeon^® D-2700 processors

THOR200-N8 shipboard server packs high-performance multi-core processing into an ultra-low profile rack space. With 1 PCIe add-on expansion slot and NVidia MXM module the 1U server can support RAID, x16 graphics, or other technologies for specific workstation requirements. The THOR200-N8 shipboard server is the ideal powerhouse workstation for optimizing rack space and performance.

The Intel^® Xeon^® D-1700 and D-2700 processors with up to 20 cores, with Integrated AI acceleration, support for hard-real-time workloads, extreme temperature range and industrial use conditions.¹ This makes them ideal for demanding applications in high-bandwidth video analytics, as well as manufacturing, aerospace, etc.

Intel^® Xeon^® D processors, enhanced for IoT, are a high-density platform that packs server-class computing and I/Os, plus accelerated AI, into compact BGA packages for soldered-down embedded and rugged designs.

THOR11-D27-HSC Block Diagram

Extended operating temperature ranges and industrial-class reliability make Intel^® Xeon^® D-1700 and D-2700 SoCs ideal for high-performance rugged equipment and sealed fanless devices that must run nonstop in the toughest environments.

Block Diagram

Appearance

System
Processor	Intel^® Xeon^® D-2712T, 4C, 8T, 1.9/3.0GHz, 15MB cache, TDP 65W
Memory Type	DDR4-2667MHz Up to 256GB Registered ECC RDIMM, Up to 512GB LRDIMM
TPM	Type: TPM 2.0 ; Header & Chip Both
BIOS	AMI UEFI BIOS
Expansion	1x PCIe 3.0 x4 Oculink 1x PCIe 4.0 x16 Slot 1x M.2 M Key 2242/2280 (1x SATA III; 1x PCIe 3.0 x 4)
USB	4x USB3.0, 2x USB2.0
Ethernet	4x GbE LAN 2x 10GbE LAN 2x 25GbE LAN
Power Type	18V~36V DC-IN MIL-STD 461 EMI Filter
Storage	4x 2.5” U.2 NVMe
Operating Temperature	-40°C to +60°C
Dimension(WxLxH)	230 x 350 x 88 mm (TBD)
Front I/O
IPMI	1x
USB3.0	2x
GbE	4x
10GbE	2x
IPMI	1x
25GbE	2x
COM	1x RS232/422/485
VGA	1x
Power Button	1x W/LED
SSD LED	1x
DC-IN	1x
Environmental
MIL-STD-810 Test	Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV(Altitude, Non Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock Procedure V Non Operating (Mechanical Shock) Method 516.6, Shock Procedure I Operating (Mechanical Shock)
Reliability	No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program.
MIL-STD-461	CE102 basic curve, 10kHz~30 MHz CS101,30 Hz~150 kHz CS114,10 kHz~200 MHz CS11550v/m CS11650v/m RE102 2MHz~18GHz RS103 2Mhz~18GHz EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3 : 10V/m EN 61000-4-4: Signal and DC Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC Net: 0.5 kV CE and FCC
MIL-STD-1275	Steady State : 2 5 V~3 0 V, Surge Low : 1 5 V/500ms, Surge High : 100V/500ms Spikes Low : -250/70uS Spikes High : +250/70uS
Operating Temp	-40°C to +60°C (ambient with air flow)
Storage Temp	-40°C to +85°C
Relative Humidity	5% to 95%, non-condensing

	THOR200-N8(New)
CPU	Intel^® Xeon^® D2712T(4C)
RAM	Up to 256GB Registered ECC RDIMM ECC, DDR4-2667MHz; Up to 512GB LRDIMM, DDR4-2667MHz
RAID	0/1/5/10
Storage	4 x 2.5" U.2 NVMe
Thermal	1 x IPMI
	1 x RS232/422/485
	4 x GbE
	2 x 10 GbE
	2 x 25 GbE
	1 x VGA
	1 x DC-IN