Intel® Core™ i7 Skylake Processor Fanless Rugged System 9V to 36V DC-in, Extended Temp. -40°C to 60°C
- Design for reliability under demanding
- MIL-STD-810G Thermal conditions
- 6th Gen Intel®Core™ i7 Skylake processor (BGA)
- Memory Up to DDR4 32GB
- Onboard uSSD SATAIII 64 GB
- Multi-Displays by 2 x DP, 1 x DVI-I
- 4 x USB 3.0, 1 x COM ( RS232/422/485 )
- 1 x Line-out / MIC-in
- 9V~36V DC-in
- Extended Temperature -40°C to 60 °C
- Technical Profile
SR10-SCHX2, which is based on EBX SBC OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring. OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85℃ to ensure ultimate durability, utmost resistance to shock & vibration.
SR10-SCHX2 highlights its 6th Generation Skylake Core™ i7 Fanless System with optional easy accessible with SSD storage tray, rugged XR-DIMM RAM, rich I/O with 4 USB 3.0, 1 Com Port (optional with 4 Com Ports), 2 LANs (optional with 4 LANs) and 3 Video outputs. SR10-SCHX2 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications.
- Wide Range DC input
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 could supporting 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.
- Advanced Thermal Technology and Rapid Heat-Dissipation
SR10-SCHX2's thermal solution designed with copper plus aluminum heat sink and 4 copper vacuum tube liquid-vapors (Heat-Pipe) which have high efficiency for heat dissipation. The rugged mechanical structure improves the cooling efficiency to secure SR10-SCHX2 maintains superior computing performance as customers desired.
- MIL-STD-810G Certified
MIL-STD-810 standard is a Military Standard established by United States Department of Defense ( DoD ) considered the utmost principle for military ruggedness request. It provides a series of testing procedures for resistance to water proof, shock, vibration, dust, humidity, and extreme temperatures and SR10-SCHX2 is designed to comply to the series of tests concerning on sustainable in such harsh environment.
- System main board: EBX SBC-OXY5739A
1. Intel® Core i7 CPU soldering onboard
SR10-SCHX2 is based on EBX SBC—OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.
2. Wide Range DC input
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations
|-40°C to 60°C|
|CPU||Intel® 6th Gen Core™ i7-6820EQ (Frequency 2.8GHz, Turbo Boost up to 3.5GHz),
Quad-Core, 8 Thread Support, 8MB SmartCache. Build-in HD Graphics 530 for excellent 3D,
Turbo Boost Technology 2.0, VPro and Hyper-Threading support.
|Memory||1 x DDR4 XR-DIMM, 1 x DDR4 SO-DIMM Total up to 32 GB|
|Chipset||Intel® QM170 Chipset supporting 6th generation Intel® Core™ processor families.|
|Expansion Slot||1 x Full-size miniPCIe / mSATA with SIM card holder 1 x Half-size miniPCIe|
|Display Port||Resolution up to 3840 x 2160|
|DVI-I||Resolution up to 1920 x 1200|
|mSATA||mSATA Solid State Disk ( SSD ) - up to 512GB Capacity.|
|DisplayPort||2 x 20Pin External connectors ( Female )|
|DVI-I||1 x 29Pin DVI-I connector ( Female )|
|Ethernet||2 x RJ45 Gigabit Ethernet LAN ( Female )|
|Audio||2 x 3.5mm Audio Jacks ( 1 x MIC, 1 x Line-Out )|
|Serial Port||1 x DB9 connector ( RS-232 / 422 / 485 )|
|USB Port||2 x USB3.0 standard-A connectors|
|DC-IN||1 x 4Pin ugged terminal block|
|Button||Power Button w/cover|
|Indicator LED||Power, HDD, LAN ( Link / Active / Speed )|
|USB Port||2 x USB3.0 standard-A connectors|
Applications, Operating System
|Applications||1 x Secure Erase Button ( SSD2 support AES Secure Erase )
1 x Power Switch with Dedicated LED
|USB||2 x USB 3.0 Ports|
|Power Input||MIL-STD-1275, MIL-STD 704 and DO-160 power supply ,12 to 40V ( 150W max )|
Applications, Operating System
|Applications||Commercial and Military Platforms Requiring Compliance to MIL-STD-810G Embedded Computing,
Process Control, Intelligent Automation and manufactur-ing applications where Harsh Temperature,
Shock, Vibration, Altitude, Dust and EMI Conditions.
|Operating System||Windows 8 , Windows 8.1 , Windows 10
Ubuntu14.04, Ubuntu 16.04
|Dimension ( W x D x H )||308 x 149 x 58 mm|
|Weight||2.96 Kg ( 6.52 lbs )|
|Chassis||Aluminum Alloy, Corrosion Resistant.|
|Finish||Anodic aluminum oxide ( Color Iron gray )|
|Cooling||Natural Passive Convection / Conduction. No Moving Parts.|
|Reliability||No Moving Parts; Passive Cooling. Designed &
Manufactured using ISO 9001/2000 Certified Quality Program.
|EMC||CE and FCC compliance|
|Green Product||RoHS, WEEE compliance|
The rugged MIL-STD compliant system, SR10-SCH-X2 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
|Test Temperature||High 0°C~70°C / Low –40°C~0°C|
|Test Time||8 Hours / 1 Hour|
|Test Standard||Reference IEC60068-2|
|Test Software||Burnin test v8.1|
|Criteria||After testing, system can't halt.|
- Test Configuration
Intel® Core i7-6820EQ, 2.8Ghz (8MB, 45W)
Intel QM170 Chipset
Inodisk 16GB (SK802) DDR4 2133
Inodisk SODIM 16GB DDR4 2133
Apacer onboard SSD 64GB
Intel(R) i210 Gigabit
Intel(R) Ethernet i219-LM
Burnin test 8.1, CPU-Z,
HW monitor 1.38, AS SSD bench
KSON THS-b4t-150, Chipeng SMO-3
- Thermal Measurement
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 8 hours which at each temperature point we burn in SR10-SCH-X2 for one hour, from -40 to 70°C.
SR10-SCH-X2 System - IO Performance
Point -40°C -20°C 0°C 25°C 55°C 60°C 65°C 70°C CPU T-J 3 18 32 60 71 77 78 85 CPU Die -22.7 -4.7 13.3 53.9 65.9 73.7 77.5 84.5 Heatsink -18.5 -0.5 17.5 57.5 70.2 75.8 76.7 82.2 Δ1=(TJ-Die) 25.7 22.7 18.7 6.1 5.1 3.3 0.5 0.5 Δ2=(Die-Sink) -4.2 -4.2 -4.2 -3.6 -4.3 -2.1 0.8 2.3 CPU Frenquency (GHz) 2.8 2.8 2.8 2.8 1.6 0.8 0.8 0.8